SLM 10TLC002L
Parametrics | Infineon SLM 10TLC002L |
---|---|
Additional Features | CIPURSE™L profile ; capability: 1 CIPURSE™ application |
Applications | micropayment ; access management ; transport ticketing |
Certifications | CIPURSE™ ; NFC Forum Type 4 Tag |
Delivery Forms | MCC8 ; NiAu-bump ; sawn wafer |
EEPROM | 304 Byte |
Interfaces | NFC Forum Type 4 Tag configurable ; ISO 14443 A |
Package | MCC8 |
Product Description | CIPURSE™move ; security architecture of CIPURSE™, built-in command set based on ISO 7816-4/-9, fully configurable file system based on ISO/ IEC 7816-4 |
Tools | CIPURSE™ development kit |
Use Cases | Public transport, ticketing ; access management ; micropayment |
Part Number: INF-SLM-10TLC002L
Contactless Security Memory featuring CIPURSE™ functionality
CIPURSE™L Profile compliant security product CIPURSE™move is the ideal product to migrate from existing e.g. none security legacy systems towards a more advanced and state-of-the-art security architecture like CIPURSE™.
Summary of Features
Hardware
- Chip hardware based on mature CMOS technology
- 17 pF chip input capacitance
- Operation temperature range -25 °C to +70 °C
- Available as sawn, bumped wafer or contactless module MCC8
Memory Organization
- ISO/IEC 7816-4 file system
- 304 Byte (2.4 kbit) user memory
- Binary, linear record and value-record files
- One CIPURSE™ application configurable
- One PxSE application configurable
- Up to 3 elementary files per CIPURSE™ application configurable
DATASHEET